For the (100) crystal face of GaAs,

For the (100) crystal face of GaAs, the simulation analysis of the scratch characteristics during the scratching process under different abrasive particle sizes is carried out. The larger the particle size of the abrasive grains, the greater the depth and width of the scratches and the normal force on the abrasive grains. The average friction coefficient during the scratching process gradually decreases. As the particle size of the abrasive grains increases, the amount of swell of the scratch increases first and then decreases. Increasing the particle size of the abrasive particles will increase the contact area between the abrasive particles and the surface of the material, and the time for polishing the workpiece will decrease accordingly. Therefore, the selection of the particle size of the abrasive particles should be based on the actual polishing processing requirements to make it able to meet the performance requirements of polishingand can improve efficiency.