Board Level Reliability Temperature Cycling: (for leadless packages)- Minimum requirement is a TC-on-board test using Daisy Chain (DC) components for all leadless packages, e.g.BGA or QFN. Test shall be done according toIPC9701 condition TC3 (-40 to 125°C). The testshall continue until at least 63% of components have failed or 2500 cycles have been completed, whichever occurs first.During TC the resistance should be measured in- situ. Daisy Chain (DC) Samples shall include VDD, VSS balls/terminals, and shall match the properties of the functional component with respect to the number of substrate layers, silicon die size,should use an 8-layer PCB with a "copper pattern density" of at least 70% unless a different board design is agreed by Road- Broad.ball-out, solder ball alloy, BOM and solder ball attach process. The routing needs to use minimum dimension design rules as applied on the final product (via size, wiring width, etc.). The signal path needs to cover the first level interconnect to the silicon die (wire bond or flip-chip bump / solder balls). Package corner balls need to be connected if they areconnected in the functional component. The test-board