不同的结构使得材料剥离方式显著不同，DWS技术切割过程中是金刚石和硅锭

Different structures make the material peeling method significantly different. The DWS technology cutting process is a two-body wear of diamond and silicon ingot, and the silicon material is peeled off along the cutting direction. During this process, there are brittle damage directly below the diamond, diamond sidewalls and silicon ingot Plastic grinding, leaving pits and smooth areas on the surface of the silicon wafer

Different structures make the material peeling method significantly different, DWS technology cutting process is diamond and ingot two-body wear, silicon material is stripped along the cutting direction, the process of the diamond is directly below the brittle destruction and diamond sidewall and silicon ingot plastic grinding, so that the silicon surface has pits and smooth areas.

In the process of cutting, the silicon material is stripped along the cutting direction. There are brittle failure under the diamond and plastic grinding of the side wall of the diamond and silicon ingot, resulting in pits and smooth areas on the surface of the silicon wafer<BR>