DRA金属基复合材料在电子封装中的应用在太空应用中蓬勃发展。对SiCp

Application of DRA in the metal matrix composite electronic package flourish in space applications. Potential applications of the reinforcing material SiCp / Al whiskers SiCw / Al comprises a truss structure, stringers, electronic packaging, thermal plane, the mechanical housing and bushing joints and accessories (Rawal, 2001). DRA composite material has the following advantages: high thermal conductivity, customizable CTE and low density, which provides a major advantage (Rawal, 2001) for the electronic packaging and thermal management applications. These components were much to manufacture than previous light metal alloy components, and by producing the mesh may further significant cost savings. DRA is currently used for communications satellites in geosynchronous earth orbit spacecraft thermal management of the power semiconductor module, so that a higher density and a lower thermal conductivity instead of the Cu / W alloy (Rawal, 2001). Compared with the copper / tungsten, reduced material weight DRA than 80% (Rawal, 2001).

The application of DRA metal-based composites in electronic packaging is booming in space applications. Potential applications for siCp/Al and crystal slab SiCw/Al enhancements include connectors and accessories for truss structures, girders, electronic packages, hot planes, mechanical housings and bushings (Rawal, 2001). DRA composites offer the following advantages: high thermal conductivity, customizable CTE and low density, which provide spalland and thermal management applications (Rawal, 2001). Not only are these components much lighter than those produced in previous metal alloys, but they can also save significant amounts of money from mesh manufacturing. DRA is also currently used in the thermal management of spacecraft power semiconductor modules in geosynchronous geoorbital communications satellites, replacing the Cu/W alloy (Rawal, 2001) with higher density and lower thermal conductivity. Compared to copper/tungsten, the weight of the DRA material is reduced by more than 80% (Rawal, 2001).

The application of DRA metal matrix composites in electronic packaging is booming in space applications. Potential applications for SiCp / Al and whisker SiCw / Al reinforcements include joints and accessories for truss structures, stringers, electronic packages, hot surfaces, mechanical housings and bushings (rawal, 2001). DRA composites have the following advantages: high thermal conductivity, customizable CTE and low density, which provide the main advantages for electronic packaging and thermal management applications (rawal, 2001). These components are not only much lighter than those produced by previous metal alloys, but also can save a lot of costs through mesh manufacturing. DRA is also currently used for thermal management of spacecraft power semiconductor modules in geosynchronous earth orbit communication satellites, thus replacing Cu / W alloy with higher density and lower thermal conductivity (rawal, 2001). Compared with copper / tungsten, the weight of DRA material is reduced by more than 80% (rawal, 2001).