半导体产业主要由集成电路、半导体分立器件、光电器件和传感器等产品构成，

The semiconductor industry is mainly composed of integrated circuits, semiconductor discrete devices, optoelectronic devices and sensors, among which integrated circuits are the largest component of the semiconductor industry and an important application field for sputtering targets. The rapid development of information technology requires the integration of integrated circuits to become higher and higher, and the size of unit devices in the circuit is constantly shrinking, and the size of components ranges from millimeters to micrometers, and then to nanometers. Each unit device is composed of a substrate, an insulating layer, a dielectric layer, a conductor layer, and a protective layer. Among them, the dielectric layer, the conductor layer and even the protective layer must be sputtered and coated. The sputtering target is used to prepare integrated circuits. One of the core materials.

The semiconductor industry is mainly composed of integrated circuits, semiconductor discrete devices, photoelectric devices, sensors and other products. Integrated circuits are the largest part of the semiconductor industry and an important application field of sputtering targets. With the rapid development of information technology, the integration of integrated circuits is required to be higher and higher, the size of unit devices in the circuit is shrinking, and the component size is from millimeter level to micron level, and then to nano level. Each unit device is composed of substrate, insulating layer, dielectric layer, conductor layer and protective layer. Among them, sputtering coating process is used for dielectric layer, conductor layer and even protective layer. Sputtering target is one of the core materials for preparing integrated circuits.

The semiconductor industry is mainly composed of integrated circuits, discrete semiconductor devices, optoelectronic devices and sensors, among which integrated circuits are the largest component of the semiconductor industry and also an important application field of sputtering targets. With the rapid development of information technology, the integrated circuit is required to be more and more integrated, and the size of unit devices in the circuit is shrinking continuously, and the size of components is from millimeter to micron, and then to nanometer. The interior of each unit device consists of substrate, insulating layer, dielectric layer, conductor layer and protective layer, among which the dielectric layer, conductor layer and even protective layer all need sputtering coating technology, and sputtering target is one of the core materials for preparing integrated circuits.