银辅助化学刻蚀和铜辅助化学刻蚀的机理本质上都是金属与硅发生的电化学反应

The mechanism of silver-assisted chemical etching and copper-assisted chemical etching is essentially an electrochemical reaction between metal and silicon. The metal deposits in the reaction as an intermediate medium for transferring holes, and the oxidant releases holes to promote the reaction. Therefore, metal-assisted chemical etching is closely related to changes in metal types and oxidants

The mechanisms of silver-assisted chemical etching and copper-assisted chemical etching are essentially electrochemical reactions between metal and silicon, in which metal is deposited as the intermediate medium for passing holes, and oxidants release holes to promote the reaction. Therefore, metal-assisted chemical etching is closely related to changes in metal types and oxidants

The mechanism of silver assisted chemical etching and copper assisted chemical etching is essentially the electrochemical reaction between metal and silicon. In the reaction, the deposition of metal acts as an intermediate medium to transfer holes, and the hole release of oxidant promotes the reaction. Therefore, metal assisted chemical etching is closely related to the variety of metal and oxidant