The main reference plane is made in order to obtain the best dicing pass rate for die division in device production, so it is also called the best dicing orientation.
The main reference surface is made to obtain the best scribe pass rate for pipe core segmentation in device production, so it is called the best scribe orientation.
The main reference plane is made to obtain the best chip pass rate of the core segmentation in the device production, so it is also called the best chip orientation.<br>