The TEM image in Figure 4d shows a

The TEM image in Figure 4d shows a thickness of PEI polymer at the interface between two grains ranging between 5 and 10 nm, as desired. The HAADF-STEM and EDS image at lower magnification (Figure 4e,i) shows that PEI is homogeneously distributed at interfaces between ZnO grains. The CSCC enabled the co-sintering of metal, polymer and ceramic to fabricate functional MLV devices with a new methodology having all process steps below 200 °C, including sintering which takes place at 120 °C only. This would not have been possible with conventional methods as high temperatures required to densify the ceramic would have led to the complete decomposition of the polymer. In the best of our knowledge, this is the lowest sintering temperature that can be found in the literature to fabricate functional ZnO-based MLV devices.