Depositing a metal plating layer (s

Depositing a metal plating layer (such as Cu or Ag) with antibacterial properties on the surface of the base material by electroplating or electroless plating is a simple method to impart antibacterial properties to the material. Electroplating technology has a wide range of applications and is not limited by the shape of the workpiece. Although Cu also has antibacterial properties and is more economical than Ag, however, because pure copper is easily oxidized, copper plating is often used as a primer coating to enhance the adhesion of other metal coatings. The commonly used antibacterial coating is Ag or a mixture of Ag and other materials. Chi GJ et al., For example, plated a layer of silver on the surface of the aluminum alloy. The anodized aluminum alloy formed micro-cavities. The Ag ions released significantly, and it has an antibacterial effect of more than 95% against Gram-positive and positive bacteria. Chi Guangjun et al. Deposited antibacterial Cu compound in the anodized film of aluminum alloy, and the antibacterial effect was remarkable. The antibacterial rate against Pseudomonas aeruginosa Escherichia coli and Staphylococcus aureus reached over 95%.