Line profiling with EDS scans (Figure 5g−i) was performed orthogonal to the metallic−ceramic layers and confirm clean interfaces with the absence of long-range cationic diffusion between adjacent layers, at least within the micrometer length scale resolution given by the probe size. Collectively, these observations confirm the quality of sintering and the feasibility of the cold sintering process, in allowing the production of multilayer device with dense microstructures and architectures, withdifferent materials, independent of their relative nature, thermal stability, or chemical compatibility.