本實施形態的硬化性樹脂組成物為含有硬化性樹脂成分、三苯基氧化膦、以及填

本实施形态的硬化性树脂组成物为含有硬化性树脂成分、三苯基氧化膦、以及填充材的硬化性树脂组成物，所述三苯基氧化膦的含有率为所述硬化性树脂组成物的0.3质量%以上。<br><br>本发明者等人的研究的结果明确，使用含有0.3质量%以上的三苯基氧化膦的硬化性树脂组成物密封而成的封装于接合时的高温条件下（例如，230℃以上）容易产生笑（smile）型翘曲（向下而成为凸状的翘曲）。其原因虽未必明确，但推测原因在于：使用硬化性树脂组成物密封而成的封装中的硬化性树脂组成物的硬化物中，三苯基氧化膦作为塑化剂发挥作用，可抑制由封装接合时的加热引起的该硬化物的膨胀。<br><br>认为若将于封装接合时容易产生笑型翘曲的硬化性树脂组成物用于其中一封装的密封，则例如于PoP型电子零件装置中与另一封装接合时，该另一封装于接合时产生笑型翘曲，于所述情况下可使封装彼此的翘曲状态一致，从而可获得良好的接合。<br><br>硬化性树脂组成物中的三苯基氧化膦的含有率若为硬化性树脂组成物整体的0.3质量%以上，则并无特别限制，可根据使用硬化性树脂组成物而制作的封装的所期望的翘曲状态、硬化性树脂组成物中所含的其他成分的含有率等来设定。<br><br>就使封装的笑型翘曲变大的观点而言，三苯基氧化膦的含有率较佳为硬化性树脂组成物整体的0.5质量%以上，更佳为1.0质量%以上，进而佳为1.5质量%以上。<br>就与硬化性树脂组成物中所含的其他成分的平衡的观点而言，三苯基氧化膦的含有率较佳为硬化性树脂组成物整体的6.0质量%以下，更佳为3.0质量%以下，进而佳为2.0质量%以下，特佳为1.0质量%以下。<br><br>硬化性树脂组成物可为固体亦可为液体。作为硬化性树脂组成物为固体时的形状，可列举粉末状、片状等。就操作性的观点而言，硬化性树脂组成物较佳为于使用时为固体，更佳为粉末状。<br><br>硬化性树脂组成物较佳为包括两个以上封装的电子零件装置中的所述两个以上封装的至少一个的密封材，更佳为所述两个以上封装中位于上侧（与配置有电子零件装置的基板为相反侧）的封装的密封材。<br><br>（硬化性树脂成分）<br><br>硬化性树脂组成物中所含的硬化性树脂成分的种类并无特别限制。就作为密封材的各种特性的平衡的观点而言，较佳为环氧树脂与硬化剂的组合。

本实施形态的硬化性树脂组成物为含有硬化性树脂成分、三苯基氧化膦、以及填充材的硬化性树脂组成物，所述三苯基氧化膦的含有率为所述硬化性树脂组成物的0.3质量%以上。<br><br>本发明者等人的研究的结果明确，使用含有0.3质量%以上的三苯基氧化膦的硬化性树脂组成物密封而成的封装于接合时的高温条件下（例如，230°C以上）容易产生笑（smile）型翘曲（向下而成为凸状的翘曲）。 其原因虽未必明确，但推测原因在于：使用硬化性树脂组成物密封而成的封装中的硬化性树脂组成物的硬化物中，三苯基氧化膦作为塑化剂发挥作用，可抑制由封装接合时的加热引起的该硬化物的膨胀。<br><br>认为若将于封装接合时容易产生笑型翘曲的硬化性树脂组成物用于其中一封装的密封，则例如于PoP型电子零件装置中与另一封装接合时，该另一封装于接合时产生笑型翘曲，于所述情况下可使封装彼此的翘曲状态一致，从而可获得良好的接合。<br><br>硬化性树脂组成物中的三苯基氧化膦的含有率若为硬化性树脂组成物整体的0.3质量%以上，则并无特别限制，可根据使用硬化性树脂组成物而制作的封装的所期望的翘曲状态、硬化性树脂组成物中所含的其他成分的含有率等来设定。<br><br>就使封装的笑型翘曲变大的观点而言，三苯基氧化膦的含有率较佳为硬化性树脂组成物整体的0.5质量%以上，更佳为1.0质量%以上，进而佳为1.5质量%以上。<br>就与硬化性树脂组成物中所含的其他成分的平衡的观点而言，三苯基氧化膦的含有率较佳为硬化性树脂组成物整体的6.0质量%以下，更佳为3.0质量%以下，进而佳为2.0质量%以下，特佳为1.0质量%以下。<br><br>硬化性树脂组成物可为固体亦可为液体。 作为硬化性树脂组成物为固体时的形状，可列举粉末状、片状等。 就操作性的观点而言，硬化性树脂组成物较佳为于使用时为固体，更佳为粉末状。<br><br>硬化性树脂组成物较佳为包括两个以上封装的电子零件装置中的所述两个以上封装的至少一个的密封材，更佳为所述两个以上封装中位于上侧（与配置有电子零件装置的基板为相反侧）的封装的密封材。<br><br>（硬化性树脂成分）<br><br>硬化性树脂组成物中所含的硬化性树脂成分的种类并无特别限制。 就作为密封材的各种特性的平衡的观点而言，较佳为环氧树脂与硬化剂的组合。

The hardenable resin component in the embodiment form is a hardening resin component containing a hardening resin component, triphenylphosphine oxide and a filler material, and the content of the triphenylphosphine oxide is more than 0.3 mass% of the hardening resin component.<br>The results of the study by the inventors and others clearly show that the package sealed with a hardened resin composition containing more than 0.3 mass% of triphenylphosphine oxide is prone to produce smile type warpage (downward and convex warpage) under high temperature conditions (e.g. above 230 ℃). Although the reason may not be clear, it is speculated that the reason is that triphenylphosphine oxide acts as a plasticizer in the hardened resin component of the package sealed with a hardening resin component, which can inhibit the expansion of the hardened material caused by heating during the bonding of the package.<br>It is considered that if the hardenable resin composition which is easy to produce smile type warpage during package bonding is applied to the sealing of one package, for example, when the other package is joined with the pop type electronic parts device, the other package will produce smile type warpage when the other package is joined. In this case, the warpage status of the packages can be consistent, thus good bonding can be achieved.<br>If the content of triphenylphosphine oxide in the hardening resin composition is more than 0.3% by mass of the whole hardening resin component, there is no special restriction. It can be set according to the expected warpage state of the package made with the hardenable resin component, the content of other components contained in the hardening resin component, etc.<br>From the point of view of increasing the warpage of the package, the content of triphenylphosphine oxide is better than 0.5% by mass of the whole component of the hardenable resin, preferably more than 1.0% by mass, and then better by more than 1.5% by mass.<br>From the point of view of balance with other components contained in the harden resin composition, the content of triphenylphosphine oxide is preferably less than 6.0 mass% of the whole harden resin composition, more preferably less than 3.0 mass%, and then preferably less than 2.0 mass%, especially better below 1.0 mass%.<br>The composition of the hardening resin can be a solid or a liquid. As the form of hardened resin when its composition is solid, powder, flake and so on can be listed. From an operational point of view, the hardenable resin composition is preferred to be solid at the time of use, preferably in the form of powder.<br>The hardenable resin composition is preferably a sealing material of at least one of the two or more packages in the electronic part device, preferably the sealing material of the package at the upper side (opposite to the substrate equipped with the electronic part device) in the two or more packages.<br>(hardening resin composition)<br>There are no special restrictions on the types of hardenable resin components contained in the hardenable resin composition. The combination of epoxy resin and hardener is better for the balance of various properties of sealing materials.<br>