模具CAD/CAE技术的出现给模具设计带来了更多的可能性，使用这些技术

The emergence of mold CAD / CAE technology has brought more possibilities to mold design. Software using these technologies can more intuitively reflect the structure of the mold, and more intuitively and scientifically reflect the process of filling the mold with plastic melt. And more clearly see the changes of various parameters during the filling process. Mold design based on these technologies will be more convenient, scientific, and efficient, allowing designers to determine defects that may occur in plastic products faster, determine appropriate process parameters faster, and speed up product design cycles. <br>This design takes the plastic lid as the research object, analyzes the structure, use and materials of the plastic lid; the mold structure is designed according to the design process of the plastic mold; CAE software MOLDFLOW is used for mold flow analysis to determine the gate location and Injection molding process parameters, and optimize accordingly to meet design requirements. The optimization of cooling reduces the temperature difference of the mold, and the optimization of the holding pressure curve makes the volume shrinkage of the plastic product more uniform, thereby reducing the amount of warpage of the plastic product. Finally, use UG / CAD software to draw the three-dimensional and two-dimensional structure of the mold.

The emergence of mold CAD/CAE technology has brought more possibilities to mold design, using the software of these technologies can more intuitively reflect the structure of the mold, more intuitive, more scientific reaction to the plastic melt filling mold process, and more clearly see the filling process of the parameters change. Mold design based on these technologies will be more convenient, more scientific and more efficient, enabling designers to identify possible defects in plastic products, determine appropriate process parameters more quickly, and speed up the cycle of product design.<br>This design takes the plastic box cover as the research object, analyzes the structure, use and use of the plastic box cover, carries on the design of the mold structure according to the design process of the plastic mold, uses CAE software MOLDFLOW for mold flow analysis, determines the gate position and injection molding process parameters, and optimizes accordingly to meet the design requirements. The cooling optimization reduces the temperature difference of the mold, and the compression curve optimization makes the volume shrinkage of the plastic product more uniform, thus reducing the warp deformation of the plastic product. Finally, UG/CAD software is used to draw the three-dimensional and two-dimensional structure of the mold.

The appearance of die CAD / CAE technology brings more possibilities to die design. The software of these technologies can reflect the structure of the die more intuitively, more intuitively and more scientifically, the process of plastic melt filling the die, and more clearly see the changes of various parameters in the filling process. The mold design based on these technologies will be more convenient, more scientific and more efficient, so that designers can determine the defects of plastic products faster, determine the appropriate process parameters faster, and speed up the cycle of product design.<br>This design takes the plastic box cover as the research object, analyzes the structure, use and materials of the plastic box cover; designs the mold structure according to the design process of the plastic mold; uses the CAE software Moldflow to analyze the mold flow, determines the gate position and injection molding process parameters, and optimizes them to meet the design requirements. The cooling optimization reduces the temperature difference of the mold, and the optimization of the pressure maintaining curve makes the volume shrinkage of the plastic products more uniform, thus reducing the warpage deformation of the plastic products. Finally, UG / CAD software is used to draw the 3D and 2D structure of the die.