From B1940, a surge in the production of sintering products in the automotive, electronics and medical sectors was observed, following World War II (German, 2014; Danninger et al., 2017). The first theoretical concepts on solid state sintering were proposed by Frenkel (1945) and Kuczynski (1949) the one for liquid phase sintering by Lenel (1948) and Kingery (1959). Coble later introduced the different stages of sintering as well as different mass transport mechanisms (Coble, 1961a,b). New multiparametric methodologies to optimize physical properties, master microstructural evolution and costs of sintered materials, were rationalized by Ashby thanks to sintering maps (Ashby, 1974; Ashby and Jones, 1996). From the late 600s to date, new sintering techniques emerged. We can list microwave sintering, (Voss, 1973) selective laser sintering (Deckard, 1989) and those belonging in the category of Field Assisted Sintering Technology (FAST) taking advantage of fast firing to enhance densification (Flash Sintering, (Cologna et al., 2010) Spark Plasma Sintering (SPS), (Inoue, 1966a,b,c), etc…). Very recently, intensive efforts were focused on low-temperature sintering (o4001C) through the development of energy efficient and environmentally friendly processes. From a general point of view, major new opportunities were thus opened including the integration of inorganic materials with different structures, the processing of nanostructured ceramics, the co-sintering of ceramics, polymers or metals. The search for reducing the sintering temperature has also led to the emergence of new materials and composites in the field of multiferroics materials (Cool-SPS) (Hérisson de Beauvoir et al., 2018) and for microwave devices (Ultra Low Temperature Co-fired Ceramic (ULTCC)). Besides, the cold sintering process (CSP) and the hydrothermal sintering (HS- also called hydrothermal hot pressing), both based on the use of solvent and uniaxial pressure, have shown an impressive potential for the fabrication and the design of high performance ceramics at low temperature.