3.5. Technical: The supplier shall

3.5。技术：供应商应建立并维护质量体系，以识别清洁工艺的所有关键参数和程序，包括但不限于遮盖，清洁和最终清洁。应建立过程规程，通过该过程规程可以指定，记录和跟踪过程参数。一旦获得“组件特定批准”，供应商不得根据应用材料QMS文件05.4-25中定义的程序，在未经负责的应用材料组织事先书面批准的情况下更改关键工艺参数。<br>3.5.1。一般要求：<br>3.5.1.1。所有机加工应在化学清洁之前完成。<br>3.5.1.2。经过化学清洁/纹理处理后，应满足图纸上的所有尺寸。对于金属部件，通过化学蚀刻去除的最大材料每侧应小于0.0003英寸。<br>3.5.1.3。表面光洁度应符合图纸要求，尽管在化学清洗过程中可能会发生一些降解。<br>（注意：由于化学蚀刻的影响，重新清洁可能会导致材料损失。供应商有责任确保重新清洁的组件的所有尺寸均符合图纸要求。）<br>3.5.2。离子污染：除非另有说明，否则按4.5.1规定的测试方法确定的（部件或试样的）清洁表面的离子污染应符合表I所列标准。<br>3.5.3。痕量金属污染（仅陶瓷和石英清洁）：除非另有说明，否则按4.5.2中的测试方法确定的总表面综合污染水平应符合表I所列标准。

3.5. 技术：供应商应建立和维护质量体系，确定清洁过程的所有关键参数和程序，包括但不限于遮蔽、清洁和最终清洁。流程程序应根据流程参数的指定、记录和跟踪确定。一旦"组件特定批准"获得批准，供应商不得根据应用材料 QMS 文件 05.4-25 中定义的程序，未经负责的应用材料组织事先书面批准而更改关键流程参数。<br>3.5.1. 一般要求：<br>3.5.1.1. 所有加工应在化学清洗前完成。<br>3.5.1.2. 图纸上的所有尺寸应在化学清洗/纹图后满足。对于金属部件，化学蚀刻的最大材料去除量应小于每侧 0.0003 英寸。<br>3.5.1.3. 表面表面表面应符合图纸的要求，尽管在化学清洗过程中可能发生一些退化。<br>（注：由于化学蚀刻的影响，重新清洁可能导致材料的额外损失。供应商有责任确保重新清洁的部件的所有尺寸都符合图纸的要求。<br>3.5.2. 离子污染：除另有说明外，4.5.1中规定的测试方法确定的清洁表面（组件或优惠券）的离子污染应符合表一所列标准。<br>3.5.3. 跟踪金属污染（仅限陶瓷和石英清洁）：除另有说明外，4.5.2测试方法确定的表面污染总量应符合表一所列标准。

3.5. Technical: The supplier shall establish and maintain a quality system that identifies all critical parameters and procedures for cleaning processes, including but not limited to masking, cleaning and final cleaning. Process procedures shall be established by which process parameters are specified, recorded and tracked. Once “Component Specific Approval” has been granted, the supplier shall not change a critical process parameter without prior written approval from the responsible Applied Materials Organizations in accordance with procedure defined in Applied Materials QMS document 05.4-25. 3.5.1. General Requirements:3.5.1.1. All machining shall be completed prior to chemical cleaning.3.5.1.2. All dimensions on drawings shall be met after chemical cleaning/texturing. For metallic components, maximum material removal by chemical etching shall be less than 0.0003 inch per side.3.5.1.3. Surface finishes shall meet the requirements on drawings though some degradation may occur during chemical cleaning.(Note: Re-cleaning may result in additional loss of materials due to effects of chemical etching. Suppliers assume the responsibility to ensure that all dimensions of re-cleaned components meet the requirements on drawings.)3.5.2. Ionic Contamination: Unless otherwise specified, ionic contamination of cleaned surfaces (of component or coupons) as determined by the test method specified in 4.5.1 shall meet the criteria listed in Table I.3.5.3. Trace Metal Contamination (Cleaning of Ceramics and Quartz only): Unless otherwise specified, total combined surface contamination level as determined by the test method in 4.5.2, shall meet the criteria listed in Table I.<br>