[OF THE INVENTION] the present inve

发明效果本发明具有优异的耐热性，用于印刷线路板层压板和印刷线路板的电子部件，半导体密封材料，诸如电子材料的半导体安装模块，汽车，车辆。与可热固化组合物中使用的飞机，建筑物，机器等或其固化产物有关。<br><br>本发明也是在印刷线路板上的预浸料的热固性组合物，一种金属包覆的层压板。<br><br>背景技术[0002]使用热固性树脂组合物，除塑料的特性例如量产性，高温下的稳定性，优异的可靠性外，在各种工业领域中已经广泛使用了重量轻，成本低的热固性树脂组合物。然而，商业上实际使用的热固性树脂，酚醛树脂，三聚氰胺树脂，尿素树脂，环氧树脂等限于少数，这些的功能仅取决于添加剂或填料的作用。众所周知，树脂本身是一种高功能的手段，而所谓的超级工程的复杂结构是有效的，其中高功能的程度基本上与这些添加剂的量成正比，<br><br>近来，已发现具有二氢苯并恶嗪环的化合物利用热固性树脂的开环聚合反应，可获得高耐热性，阻燃性，固化物高机械强度的报告。例如，《高分子科学杂志：B部分：高分子物理学》，第1卷。在日本专利32、92 1-927（1994）中，苯并恶嗪化合物2的固化产物的各种功能特性或JP-4-227922公开了一种具有环氧树脂的二氢苯并恶嗪化合物和该树脂组合物，公开号JP-7-188364和应用聚合物科学杂志，卷。58、1 751-1760（1995）或在分子中作为添加剂的一种酚羟基是通过将化合物共固化来增强二氢苯并恶嗪而显示的。<br><br>但是，这些研究报告仅报道了二氢苯并恶嗪化合物还很少，其他树脂体系，特别是聚酰亚胺等高耐热性树脂等复杂结构的作用至今仍不知道。<br><br>[本发明要解决的问题]本发明的具有热固性树脂的具有二氢苯并恶嗪环的固化物的高耐热性，高强度而没有很多昂贵且复杂的马来酰亚胺化合物为热固性组合物，旨在提供固化产品。<br><br>本发明还可以提供耐热性，机械强度优异的预浸料，覆金属箔层压板，印刷线路板的热固性组合物。<br><br>[解决问题的方法]本发明的发明人为通过认真研究实现上述目的，通过混合热固性树脂将具有少量马来酰亚胺环的具有二氢苯并恶嗪环的热固性树脂，热固性树脂混合在一起。基于该知识，具有二氢苯并恶嗪环的具有显着改善所发现的固化产物的特性的特征并完成了本发明。<br><br>即，本发明具有以热固性树脂为主要成分和热固性树脂的二氢苯并恶嗪环和马来酰亚胺环，具有热固性树脂和马来酰亚胺环的热固性树脂相对于热固性树脂的二氢苯并恶嗪环的含有比例的马来酰亚胺环。在本发明的热固性组合物中，其含量为3-30重量％。<br><br>[本发明的实施方案]在本发明的热固性组合物中，具有二氢苯并恶嗪环作为热固性树脂的马来酰亚胺环，其中热固性树脂和马来酰亚胺环的含量相对于热固性树脂的总量为3。 -30重量％是必要的。另一方面，具有热固性树脂的含有比例的马来酰亚胺环小于该范围，另一方面，具有特定特性的环的马来酰亚胺固化具有特性的环的热固性树脂，特别是不能获得提高玻璃化转变温度的效果。树脂的固化物的脆性变得明显，二氢苯并恶嗪环可以由廉价的原料制成，并且失去了具有商业优势的热固性树脂。<br><br>在本发明中用作具有二氢苯并恶嗪的热固性树脂

[发明]本发明，是优良的耐热性，电子元件，用于印刷布线板层压板和印刷布线板，半导体密封材料，半导体安装模块等电子材料，汽车，车辆，飞机，建筑，机器等用于热固化组合物及其固化产品相关。<br><br>本发明还把预热材料的热固性组合物，一种金属覆盖的层压板，放在印刷的接线板上。<br><br>[优先技术]采用热固性树脂组合物，重量轻，成本低，除了具有塑料质量生产率、高温稳定性、优良可靠性等特点外，在工业各个领域得到了广泛的应用。然而商业实际使用的热固性树脂、苯酚树脂、三聚氰胺树脂、尿素树脂、环氧树脂等仅限于少数，这些功能完全取决于添加剂或填料的贡献。树脂本身作为高功能的手段，而所谓的超级工程的复杂结构是众所周知的有效，高函数的程度与这些添加剂的数量成正比，为了改善足够的特性，必须使用大量的昂贵的超级工程手段，并且它们可投入商业使用。<br><br>最近，一种具有二氢佐松酶环的化合物利用环开口聚合反应的热固性树脂，已发现，高耐热性、阻燃性、高机械强度的固化产品的报告，可以获得。例如，《P类科学杂志：B：第1部分：聚合物物理》，第32卷，92 1-927（1994年），苯氧乙酰化合物2或JP-4-227922的固化产品的各种功能特性，揭示了一种二氢对羟基化合物与环氧树脂和树脂组合物， 出版物JP-7-188364和应用聚合物科学杂志，第58卷，1 751-1760（1995年）或作为分子中的添加剂是一种酚类羟基组，通过共同固化化合物来增强显示二氢苯二氮黄辛。<br><br>然而，这些研究已经报告，但二氢佐松糖素化合物只是轻微，其他树脂系统，特别是高耐热树脂的聚酰亚胺等复杂结构的效果，直到现在才知道。<br><br>[本发明要解决的问题]本发明，由于耐热性高，具有高耐热性、高强度的固化产品具有含有热固性树脂的二氢苯二甲酸酯环是一种热固性组合物，其固化产品旨在提供。<br><br>本发明还具有耐热性组合物，在机械强度上优异，以预热板、金属箔层压板、印刷线板为主，

[OF THE INVENTION] the present invention, is excellent in heat resistance, the electronic component, for a printed wiring board laminates and printed wiring board, the semiconductor sealing material, the semiconductor-mounted module such as an electronic material, an automobile, vehicle, aircraft, building, machine or the like used in the heat-curable composition and its cured product related.The present invention is also, the thermosetting composition of the prepreg, a metal-clad laminate, on the printed wiring board.[Prior art] a thermosetting resin composition is used, light weight, low cost, in addition to the characteristics of the plastics such as mass productivity, stability at high temperatures, excellent reliability in various fields of industry has been widely used. However the commercial actually used a thermosetting resin, a phenol resin, melamine resin, urea resin, epoxy resin or the like is limited to a few, the function of these exclusively depending on the contribution of the additive or the filler. Of the resin itself as a means for a high function, and a complex structure of the so-called superengineering are known to be effective, the degree of a high function for substantially proportional to the amount of these additives, in order to improve the characteristics of the sufficient large amount of expensive superengineering means must be used and they are commercially available.Recently, a compound having a dihydrobenzoxazine ring the use of a ring opening polymerization reaction of a thermosetting resin which has been found, high heat resistance, flame retardancy, high mechanical strength of a cured product of a report that can be obtained. For example, Journal of P olymer Science: Part B: Polymer Physics, Vol. 32, 92 1-927 (1994) a variety of functional characteristics of a cured product of the benzoxazine compound 2, or JP-4-227922 discloses a dihydrobenzoxazine compound with an epoxy resin and the resin composition, the publication JP-7-188364 and Journal of Applied Polymer Science, Vol. 58, 1 751-1760 (1995) or as an additive in the molecule is a kind of the phenolic hydroxyl group by co-curing of the compound to enhance the dihydrobenzoxazine be shown.However, these studies have been reported yet dihydrobenzoxazine compound only slightly, the other resin system, particularly a high heat resistant resin of polyimide or the like complex structure of the effect is not known until now.[Problem to be solved by the invention] the present invention, the maleimide compound without a lot of expensive and complex due to the high heat resistance, high strength of a cured product having a dihydrobenzoxazine ring containing the thermosetting resin is a thermosetting composition and its cured product is intended to provide.The present invention is also, the thermosetting composition of the heat-resistant, excellent in mechanical strength to the prepreg, metal foil-clad laminate plate, the printed wiring board can be provided for the purpose.[Means for solving the problem] the inventors of the present invention in order to achieve the above object as a result of earnest studies, a thermosetting resin having a dihydrobenzoxazine ring having a small amount of maleimide ring by mixing a thermosetting resin, a thermosetting resin having a dihydrobenzoxazine ring greatly improving the characteristics of the cured product of the found, based on this knowledge and have completed the present invention.That is, the present invention having a dihydrobenzoxazine ring and maleimide ring having a thermosetting resin as an essential component and a thermosetting resin, a maleimide ring having a dihydrobenzoxazine ring content ratio of the thermosetting resin to the thermosetting resin having the thermosetting resin and maleimide ring on the total amount of 3-30 weight % in the thermosetting composition and according to the present invention.[Embodiment of the present invention] in the thermosetting composition of the present invention, the maleimide ring having a dihydrobenzoxazine ring as a thermosetting resin having a content ratio of the thermosetting resin and the maleimide ring relative to the total amount of the thermosetting resin is 3-30 weight % is necessary. Maleimide ring having a content ratio of the thermosetting resin is less than this range maleimide curing the thermosetting resin having a ring of characteristics, particularly the effect of improving the glass transition temperature is not obtained, on the other hand more than this range of specific imide resin cured product becomes obvious in the brittleness of the, the dihydrobenzoxazine ring may be made from inexpensive raw material and the thermosetting resin having the advantages of a commercial is lost. Maleimide ring having a content ratio of the thermosetting resin is more preferably in a range of 5-20 weight % is in.Used in the present invention as a thermosetting resin having a dihydrobenzoxazine r<br>